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Windows操作軟體
注意事項
- Win10、Win11可使用。
- 重新設置噴嘴高度時,機台動作會準確的與電腦操作同步,做上升和下降動作。
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為兼容匹配【早期Box機型】的「平台高度」偵測功能。
平台的上升、下降數值,軟體畫面會延遲1秒才顯示,請您注意【勿快速重覆點擊】,避免平台升高過度而撞到噴嘴。
Release Notes
- Added support for UP mini 3 in Material Profile Editor
- Various performance improvement and bug fixes.
- 適用UP600/UP600D、UP350/UP350D、UP200三個機型。
- 更新matdef:增加UP Plus2、UP600/UP600D、UP350/UP350D、UP200機型及參數。
- UP300D、UP600D、UP350D三個機型隱藏線材擠出、撤回操作(單、雙噴頭都隱藏)。
- 修復第一次安裝時,需要連接印表機才能載入模型的問題。
- 適用新的校準模塊(應變片)。
- 不支援UP600/UP600D的自動對高和九點校準。
1, When working with Touchscreen Program over v1.5, users can specify the number of prints before hit the “Print”.
2, Fixed the issue that data transmission could not be stopped.
3, The Task file data transmission is optimized if working with Touch Screen Program 1.5.7 and above.
The Touch Screen Program 1.5.7 has been released. Please upgrade your machine.
1, When working with Touchscreen Program over v1.5, users can specify the number of prints before hit the “Print”.
2, Fixed the issue that data transmission could not be stopped.
3, The Task file data transmission is optimized if working with Touch Screen Program 1.5.7 and above.
The Touch Screen Program 1.5.7 has been released. Please upgrade your machine.
- Enhanced the workflow for Material Profile Manager (MPM). Now, you do not need to restart the UP Studio after making changes in the MPM.
- Added a feature for build plate auto-heating: After clicking Print or Send (in the tsk mode) button, the printer will start heating up the build plate automatically. If the print job does not start in 5 minutes, the heating process will stop.
- Updated the Digital Signature.
- Various Performance optimization
- Minor bug fixes.
Warning: All the previous material settings in UP Studio 2.4 or earlier will be erased after this update.
- Enhanced the workflow for Material Profile Manager (MPM). Now, you do not need to restart the UP Studio after making changes in the MPM.
- Added a feature for build plate auto-heating: After clicking Print or Send (in the tsk mode) button, the printer will start heating up the build plate automatically. If the print job does not start in 5 minutes, the heating process will stop.
- Updated the Digital Signature.
- Various Performance optimization
- Minor bug fixes.
Warning: All the previous material settings in UP Studio 2.4 or earlier will be erased after this update.
版本說明:
- 1、增加了新配方材料的選項。
- 材料選項ABS+,是針對編號C-23xx或C-13xx的ABS新配方材料設計的參數。
- 2、列印頁面增加Thin wall功能。
- STL文件中0.1mm - 0.5mm 的設計部份,藉由勾選了Thin wall功能,將會被列印出來。
Release Notes:
- Support of new CPU
- Various bug fixes, including the fix for auto leveling and height adjustment bug